Wafer level mems package including dual seal ring

ABSTRACT

A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

GOVERNMENT LICENSE RIGHTS

This invention was made with Government support under HR0011-11-C-0125awarded by the Government. The Government has certain rights in theinvention.

BACKGROUND

The present disclosure relates to microelectromechanical systems (MEMS),and more particularly, to microbolometer package design.

Microelectromechanical systems (MEMS) are made up of one or more verysmall scale electrical components. For example, MEMS devices included ina MEMS can range in size from, for example, approximately 20 micrometers(μm) to approximately 1 millimeter (mm). Microbolometers are a type ofMEMS device that include a thermal sensitive material having atemperature-dependent electrical resistance. One feature ofmicrobolometers is the capability of measuring the power of incidentelectromagnetic radiation in response to receiving thermal or radiationenergy. In essence, the microbolometer behaves as an image pixel, wherethe output intensity of the pixel is based on the amountthermal/radiation energy received. Accordingly, microbolometers arewidely used in various energy sensing devices, such as infrared (IR)sensors, thermal imaging cameras, and night vision cameras, for example,to generate an image in response to thermal/radiation energystimulation.

One design characteristic of microbolometers is the requirement of ahigh vacuum environment that thermally isolates the microbolometers fromthe external ambient temperatures, i.e., external thermal energy.Referring to FIG. 1, for example, a MEMS package 5 includes amicrobolometer package 10. Microbolometer packages 10 typically includea vacuum region 15 created by sealing a wafer level package (WLP) 20 toa window cap wafer 25 (i.e., window lid 25) via a single narrow ringseal 30. The WLP 20 includes one or more reference pixels (RPs) 35disposed thereon. Thus, the vacuum region 15 defines a clearance (d)between the RPs 35 and the window lid 25. However, the vacuum within thevacuum region 15 creates a pressure differential with respect to theexterior atmospheric pressure that causes the window lid 25 todeform/deflect toward the WLP 20 and into the vacuum region 15.

Conventional microbolometer packages 10 use only the single narrow sealring 30 formed on a metal under-layer (U/L) between the WLP 20 and thewindow lid 25 to reduce stress and deflection of the window lid 25. Fora 1D case we can treat this as a simple beam to understand how thedeflection and stress at the joint are a strong function of the distancebetween the solder joints (span). The deflection in the window can beassociated by the following formula:

$\begin{matrix}{{Y_{\max} = {{{- \frac{w_{a}l^{4}}{384{EI}}}\mspace{14mu} {at}\mspace{14mu} X} = {L/2}}},{where}} & (1)\end{matrix}$

-   Wa is force per unit length for the 1D case,-   E is the young's modulus and is a material property of the window,    and-   I is the area moment of inertia, which can be further described as:

$I = \frac{{bh}^{3}}{12}$

where h is the thickness of the window.

From equation 1, it can be appreciated that the deflection increaseswith the span (length) to the fourth power so that a small increase inspan causes a much large increase in deflection. The bending moment onthe joint is cause by the force that is exerted on the window. Thisscales directly with the area of the window. For the 1D case it scalesdirectly with the span. Further, the pressure is defined as P=F/A, where“F” is force and “A” is area, and the pressure for is fixed at 1atmosphere. However, the area “A” will change with the increase in thespan. Thus, as the area “A” changes so does force “F”. Since there is avacuum at vacuum region 15, the larger the span, the larger the force(F). The larger the force (F) that is creating the moment, the greaterthe stress also at the joint.

Referring to FIGS. 2A-2B, experimental results further illustrate thatthe pressure differential increases as the size of vacuum region 15 isincreases, thereby increasing the deflection of the window lid 25. Ifthe vacuum region 15 is formed too large, the window lid 25 is allowedto pivot about the seal ring 30 and can contact and/or crush the RPs 35(see FIG. 1). One conventional solution to counteract the increase indeflection is to increase the thickness of the window lid 25. However,incident electromagnetic radiation is inhibited from reaching the WLP 20as the window lid 25 thickness is increased. Consequently, conventionalmicrobolometer package designs are limited to the size of the cavityregion and the thickness of the window lid, which ultimately limits theoverall thermal sensitivity and image quality of the imaging device.

SUMMARY

According to one embodiment, a microelectromechanical systems (MEMS)package includes a substrate extending between a first pair of outeredges to define a length and a second pair of outer edges to define awidth. A seal ring assembly is disposed on the substrate and includes atleast one seal ring creating a first boundary point adjacent to at leastone MEMS device and a second boundary point adjacent at least one of theouter edges. The package further includes a window lid on the seal ringassembly to define a seal gap containing the at least one MEMS device.The seal ring assembly anchors the window lid to the substrate at thesecond boundary point such that deflection of the window lid into theseal gap is reduced.

According to another embodiment, a method of reducing deflection of awindow lid included in a MEMS package comprises forming a seal ringassembly including at least one seal ring on an upper surface of asubstrate to create a first boundary point adjacent at least one MEMSdevice formed on the upper surface, and a second boundary point adjacentat least one of outer edge of the substrate. The method further includesforming a window lid on the seal ring assembly to define a seal gapcontaining the at least one MEMS device. The method further includesanchoring the window lid to the substrate via at least the secondboundary point such that the deflection of the window lid into the sealgap is reduced.

Additional features and advantages are realized through the techniquesof the present invention. Other embodiments and aspects of the inventionare described in detail herein and are considered a part of the claimedinvention. For a better understanding of the invention with theadvantages and the features, refer to the description and to thedrawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

For a more complete understanding of this disclosure, reference is nowmade to the following brief description, taken in connection with theaccompanying drawings and detailed description, wherein like referencenumerals represent like parts:

FIG. 1 is a cross-sectional view of a conventional microbolometerpackage including a single narrow seal ring and a window lid capable ofpivoting about the seal ring in response to atmospheric pressure;

FIG. 2A is a line graph illustrating window deflection of a conventionalmicrobolometer package versus cavity size of the microbolometer package;

FIG. 2B is table illustrating the data shown in the line graph of FIG.2A;

FIG. 3A is a top view of a microbolometer package including a dual sealring assembly according to a non-limiting embodiment; and

FIG. 3B is a cross-sectional view of the microbolometer package takenalong line A-A′ and showing the dual seal ring assembly inhibiting thewindow lid from deflecting into the cavity region;

FIG. 4 is a table summarizing analysis results of various microbolometerpackage designs including a dual seal ring assembly compared toconventional package designs including a single narrow seal ring;

FIGS. 5A-5B illustrate a microbolometer package including a wide sealring assembly according to another non-limiting embodiment; and

FIGS. 6A-6B illustrate a top view of a microbolometer package includinga dual seal assembly with a non-continuous seal ring and a continuousseal ring according to another non-limiting embodiment.

DETAILED DESCRIPTION

Various non-limiting embodiments of the disclosure provide a MEMSpackage such as, for example a microbolometer package, including a dualseal ring assembly that reduces window lid deformation and deflectioncompared to conventional microbolometer packages having only a singlenarrow seal ring. According to an embodiment, the dual seal ringassembly includes an inner seal ring disposed at a close vicinity to oneor more MEMS devices such as a video reference pixel (VRP) group, forexample, and an outer seal ring disposed at a close vicinity to one ormore edges edge of the MEMS package. The arrangement of the inner sealring and outer seal ring prevents the window lid from pivoting about theinner seal ring, thereby reducing the deflection of the window lid. Inthis manner, a cavity region of the MEMS package can be increased suchthat a larger pixel array (i.e., a greater number of pixels) can beimplemented in the MEMS package. Moreover, the thickness of the windowlid can be reduced, thereby improving the thermal sensitivity of theMEMS package. Accordingly, an imaging device implementing the MEMSpackage designed according to at least one embodiment of the inventiveteachings realizes improved image quality.

With reference now to FIGS. 3A and 3B, a microelectromechanical system(MEMS) package 100 is illustrated according to a non-limitingembodiment. According to a non-limiting embodiment, the MEMS package 100is constructed as a microbolometer package, but the invention is notlimited thereto. The MEMS package 100 includes a substrate 102 and awindow lid 104. The substrate 102 extends along a first axis to define asubstrate length, a second axis to define a substrate width, and a thirdaxis to define a substrate height. The substrate 102 can be formed fromvarious semiconductor materials including, but not limited to, silicon(Si), and can have a typical thickness ranging from approximately 200 μmto approximately 800 μm, however it should be appreciated that these arenominal values and the values could be thinner or thicker depending onthe application. The window lid 104 is formed from a material that istransparent in the wavelength of interest such as, for example, siliconin the infrared wavelengths of 8-12 microns and is coupled to thesubstrate 102 via a dual seal ring assembly which is discussed ingreater detail below.

The dual seal ring assembly creates a hermetic seal that protects theregions between the dual seal ring assembly, the window lid 104, and thesubstrate 102 from the external environment surrounding the MEMS package100 and enables a vacuum environment within the cavity region 108 of the100. According to a non-limiting embodiment, the window lid 104 includesan inner lip 106 that extends from the ends of the inner surface of thewindow lid 104. The inner lip 106 is sealed against the dual seal ringassembly such that a cavity region 108 and a seal gap 110 are formedbetween the substrate 102 and the window lid 104. Due to the hermeticseal created by the dual seal ring assembly, the cavity region 108 andthe seal gap 110 are protected from the environment surrounding the MEMSpackage 100. A vacuum can be established in cavity 108 and seal gap 110.According to a non-limiting embodiment, the vacuum can be used tothermally isolate one or more MEMS devices that require isolation fromtheir environment in order to improve their performance as discussed ingreater detail below. According to another non-limiting embodiment, thecavity 108 and the seal gap 110 can be backfilled with a gas to providea known background to mitigate shock and dampening. In this manner, theMEMS package 100 can be constructed as an accelerometer, for example.

The cavity region 108 has a height ranging, for example, from about 200micrometers (μm) to about 400 μm. The seal gap 110, however, has aheight ranging, for example, from about 2 μm to about 12 μm. It shouldbe appreciated, however, that the height of the seal gap 100 is notlimited thereto so long there is no physical contact between the windowlid 104 and the VRP group 114. Further, the portion of the window lid104 located above the cavity 108 may have a thickness ranging, forexample, from approximately 100 μm to approximately 1000 μm depending onthe application and design intent.

The MEMS package 100 further includes one or more MEMS devices. Forexample, the MEMS package 100 includes a pixel array 112 and a VRP group114. The pixel array 112 includes a plurality of sensors such asinfrared radiation sensors, for example, formed on an upper surface ofthe substrate 102 located in the cavity region 108. The sensor can beconfigured as microbolometer such that the MEMS can be constructed as amicrobolometer package. Accordingly, the pixel array 112 is interposedbetween the inner surface of the window lid 104 and the substrate 102.The VRP group 114 is formed on a second portion of the substrate 102located in the seal gap 110. Accordingly, the VRP group 114 isinterposed between the inner lip 106 and the substrate 102. Each sensorincluded in the pixel array 112 is configured to detect infraredradiation, e.g., wavelengths between about 7.5 μm and about 14 μm, forexample. In response to the infrared radiation, the electricalresistance of the microbolometer changes. This resistance change ismeasured and processed into temperatures which can be used to create animage as understood by one of ordinary skill in the art. The VRP group114 also includes one or more microbolometers. Unlike the pixel array112, however, the microbolometers of the VRP group 114 are shielded fromreceiving infrared radiation via a VRP shield 116, for example. The VRPshield 116 can be formed from any material that blocks radiation fromreaching the VRP group 114. In this manner, the VRP group 114 is used asa reference to distinguish infrared radiation received at the pixelarray 112 from general noise existing in the pixel environment.

As further illustrated in FIGS. 3A-3B, the dual seal ring assemblyaccording to a non-limiting embodiment includes an inner seal ring 118 aand an outer seal ring 118 b. Each of the inner seal ring 118 a and theouter seal ring 118 b extends between the substrate 102 and the windowlid 104 to define a height of approximately 7 μm (but could be muchsmall at 2 microns and larger at 12 microns) and each extends along alength of the substrate 102 to define a seal length ranging fromapproximately 200 μm to approximately 250 μm. It should be appreciated,however, that each seal ring 118 a/ 118 b can be larger or smaller inwidth depending on the geometry of the MEMS package 100. Each of theinner seal ring 118 a and the outer seal ring 118 b are formed from ahermetic seal material that creates an airtight seal that protects thecavity region 108 and the seal gap 110 from the exterior environment.The hermetic material includes various materials including, but notlimited to, AuSn solder and its alloys, Indium solder and its alloys,SnPb and its alloys titanium (Ti), a fusible metal alloy material suchas a Ti-based solder material, or a glass frit material, for example.

According to a non-limiting embodiment, the inner seal ring 118 a andthe outer seal ring 118 b are formed at particular locations on thesubstrate 102 to define the desired boundary conditions of the MEMSpackage 100. For example, the inner seal ring 118 a may be formed asclose as possible to the VRP group 114, while the outer seal ring 118 bis formed from as close as possible to the outer edge of the inner lip106. Accordingly, a seal void 120 is formed between the inner seal ring118 a and the outer seal ring 118 b. The distance between the inner sealring 118 a and the outer seal ring 118 b can vary according to theparticular dimensions of the MEMS package 100. However, at least oneembodiment includes a seal void 120 having a distance of approximately250 μm that separates the inner seal ring 118 a from the outer seal ring118 b. In this manner, a hermetic seal is created that forms the vacuumseal and protects the cavity region 108 and seal gap 110 from theexternal environment, while the outer seal ring 118 b anchors the innerlip 106 to the substrate 102. Accordingly, the outer edge of the innerlip 106 is prevented from pivoting about the inner seal ring 118 a,thereby reducing deflection of the window lid 104. In other words, theouter seal ring 118 b reduces window deflection, thereby preventing thewindow lid 104 from contacting the VRP group 114.

As described in detail above, at least one non-limiting embodimentdescribed above provides a MEMS package 100 including a dual seal ringassembly having an inner seal ring 118 a spaced apart from an outer sealring 118 b. The outer seal ring 118 b anchors the window lid 104 to thesubstrate 102, thereby reducing deflection of the window lid 104.Referring to FIG. 4, for example, a table showing test results ofvarious dual seal ring assembly designs compared to a single seal ringassembly design are shown. It can be appreciated from the results thatthe dual seal ring assembly design allows a window lid deflection ofapproximately 0.87 μm compared to a single seal ring assembly designthat allows for a window lid deflection of approximately 1.69 μm. Inother words, the dual seal ring assembly reduces the window liddeflection by almost half. Moreover, the implementation of an inner sealring 118 a and an outer seal ring 118 b greatly reduces the window lidstress applied to the seal ring assembly. For example, a conventionalmicrobolometer package having only a single, narrow seal ring realizes awindow lid stress of approximately 17,010 pounds per square inch (PSI).However, implementing a dual seal ring assembly into the samemicrobolometer package reduces the window lid pressure applied to theseal ring assembly to approximately 4,264 PSI. Accordingly, the dualseal ring assembly reduces the window lid stress by approximately fourtimes. Therefore, since the dual seal ring assembly reduces the windowdeflection and the overall stress applied to the seal assembly itself,the MEMS package 100, according to at least one embodiment of thedisclosure, can be designed with a larger cavity region 108 while usinga thinner window lid 104 as compared to convention microbolometerpackages.

Referring now to FIGS. 5A-5B, a MEMS package 100 is illustratedaccording to another non-limiting embodiment. The microbolometer package100 illustrated in FIGS. 5A-5B replaces the dual seal ring assemblyincluding the inner seal ring 118 a and outer seal ring 118 b with awide seal ring assembly 122. The wide seal ring assembly 122 includes aninner edge 124 a and an outer edge 124 b. The inner edge 124 a couplesthe window lid 104 to the substrate 102 at an inner boundary point 126a. The outer edge 124 b couples the window lid 104 to the substrate 102at an outer boundary point 126 b. In this manner, the width of the wideseal ring 122 can be sized such that the inner edge 124 a and outer edge124 b define the desired boundary conditions of the MEMS package 100.Accordingly, the outer edge 124 b prevents the wide seal ring assembly122 from pivoting about the inner boundary point 126 a such that thedeflection of the window lid 104 is reduced. As a result, the size ofthe cavity region 108 can be increased while the thickness of the windowlid 104 can be reduced to provide a MEMS package 100 having greaterprecision than conventional microbolometer packages.

Referring now to FIG. 6A and 6B, a top view of a dual seal ring assembly122 is illustrated according to another non-limiting embodiment. Thedual seal ring assembly 122 includes a continuous seal ring 118 and anon-continuous seal ring 128. The continuous seal ring 118 can beinterposed between the non-continuous seal ring 128 and the cavity (seeFIG. 6A). Alternatively, the non-continuous seal ring 128 can beinterposed between the continuous seal ring 118 and the cavity 108. Thecontinuous seal ring 118 is configured to form a hermetic seal, whilethe non-continuous seal ring 128 is formed of discrete elements havingbreaks or voids 130 therebetween. In this manner, the non-continuousseal ring 128 allows solder to be conserved while still providingsupport. Although only two seal rings are illustrated, it is appreciatedthat more than two-seal rings can exist, so long as at least one sealring is configured as a continuous seal ring 118 to provide the hermeticseal.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present invention has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the invention. Theembodiments were chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated.

While the preferred embodiments to the invention have been described, itwill be understood that those skilled in the art, both now and in thefuture, may make various improvements and enhancements which fall withinthe scope of the claims which follow. These claims should be construedto maintain the proper protection for the invention first described.

1. A microelectromechanical systems (MEMS) package, comprising: asubstrate extending between a first pair of outer edges to define alength and a second pair of outer edges to define a width; a seal ringassembly on the substrate, the seal ring assembly including at least oneseal ring creating a first boundary point adjacent to at least one MEMSdevice and a second boundary point adjacent at least one of the outeredges; and a window lid on the seal ring assembly to define a seal gapcontaining the at least one MEMS device, wherein the seal ring assemblyanchors the window lid to the substrate at the second boundary pointsuch that deflection of the window lid into the seal gap is reduced,wherein the seal ring assembly includes an inner seal ring that directlycontacts a first area of the substrate and, and outer seal ring spacedapart from the first seal ring, the outer seal ring directly contactinga second area of the substrate different from the first area and definesthe second boundary point.
 2. (canceled)
 3. (canceled)
 4. (canceled) 5.(canceled)
 6. The MEMS package of claim 1, wherein the window lidextends between a first pair of window edges and a second pair of windowedges to define a window lid surface, at least one of the window edgescoupled to the outer seal ring to inhibit the window lid from pivotingabout the inner seal ring.
 7. (canceled)
 8. The MEMS package of claim 1,wherein the inner seal ring and the outer seal ring each comprises asealing material configured to form the hermetic seal.
 9. The MEMSpackage of claim 1, wherein the at least one MEMS device includes anenergy pixel array on an upper surface of the substrate, and at leastone reference pixel on the upper surface of the substrate that providesa reference to the pixel array, and wherein the window lid defines acavity region containing the energy pixel array, the window lid and sealassembly thermally isolating the cavity region and the seal gap from anexternal environment surrounding the MEMS package and forming aninfrared sensor device.
 10. The MEMS package of claim 1, wherein the atleast one seal ring is a single wide seal ring extending between anouter edge disposed adjacent at least one of the window edges and aninner edge opposite the outer edge.
 11. The MEMS package of claim 10,wherein the inner edge couples the window lid to the substrate at thefirst boundary point, and the outer edge couples the window lid to thesubstrate at the second boundary point.
 12. The MEMS package of claim11, wherein the first boundary point is directly adjacent the at leastone MEMS device such that the first boundary point is interposed betweenthe MEMS device and the second boundary point.
 13. A method of reducingdeflection of a window lid included in a MEMS package, the methodcomprising: forming a seal ring assembly including an inner seal ring onan upper surface of a substrate to create a first boundary pointadjacent at least one MEMS device formed on the upper surface, and anouter seal ring on the upper surface of the substrate and spaced apartfrom the inner seal ring to define a seal void therebetween and tocreate a second boundary point adjacent at least one of outer edge ofthe substrate, a width of the seal void being greater than each of awidth of the inner seal ring and a width of the outer seal ring;extending a portion of the seal ring completely along an outer perimeterof the substrate; forming a window lid on the seal ring assembly todefine a seal gap containing the at least one MEMS device such that ahermetic seal is formed using the seal ring assembly to protect the sealgap from an external environment surrounding the at least one MEMSdevice; and anchoring the window lid to the substrate via at least thesecond boundary point such that the deflection of the window lid intothe seal gap is reduced.
 14. (canceled)
 15. (canceled)
 16. (canceled)17. (canceled)
 18. The method of claim 13, further comprising forming atleast one window edge directly on the outer seal ring to inhibit thewindow lid from pivoting about the inner seal ring.
 19. (canceled) 20.The method of claim 13, further comprising forming each of the innerseal ring and the outer seal ring from a sealing material to create thehermetic seal.
 21. A microelectromechanical systems (MEMS) package,comprising: a substrate extending between a first pair of outer edges todefine a length and a second pair of outer edges to define a width; aseal ring assembly on the substrate, the seal ring assembly including aninner seal ring that creates a first boundary point adjacent to at leastone MEMS device and an outer seal ring that creates a second boundarypoint adjacent at least one of the outer edges, the inner seal ringbeing spaced apart from the outer seal ring to define a seal voidtherebetween; and a window lid on the seal ring assembly to define aseal gap containing the at least one MEMS device, the seal ring assemblycreating a hermetic seal that protects the seal gap from an externalenvironment surrounding the at least one MEMS device, wherein a portionof the seal ring assembly extends completely along an outer perimeter ofthe substrate, and the seal ring assembly anchors the window lid to thesubstrate at the second boundary point such that deflection of thewindow lid into the seal gap is reduced, and wherein a width of the sealvoid is greater than each of a width of the inner seal ring and a widthof the outer seal ring.